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2004
Prasher, Ravi S.."Thermal Management."The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)
1 (2004) xix–744. DOI
Prasher, Ravi S.."Thermal transport cross section and phase function of longitudinal phonons for scattering by nanoparticles and microparticles."J. Appl. Phys.
96 (2004) 5202–5211. DOI
2003
Prasher, Ravi S., Abhay A. Watwe, Gregory M . Chrysler, Kristopher J. Frutschy, , Leo Ofman, and Ajit V Sathe."Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment."
(2003).
Cho, , Eun Seok, , Jae-Mo Koo, , Linan Jiang, Ravi S. Prasher, , Min Soo Kim, , J G Santiago, , T W Kenny, and Kenneth E Goodson."Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots."Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.
(2003) 242–246. DOI
Prasher, Ravi S.."Phonon Transport in Anisotropic Scattering Particulate Media."ASME 2003 International Mechanical Engineering Congress and Exposition
(2003) 275–283. DOI
Frutschy, Kristopher J., Ravi S. Prasher, , Eric Distefano, and Ajit V Sathe."Direct heatpipe attachment to die using center point loading."
(2003).
Prasher, Ravi S.."A simplified conduction based modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."J. Electron. Packag.
(2003). DOI
Prasher, Ravi S., , P Koning, , J Shipley, and others."Dependence of thermal conductivity and mechanical rigidity of particle-laden polymeric thermal interface material on particle volume fraction."Journal of
(2003). DOI
Prasher, Ravi S.."Generalized equation of phonon radiative transport."Appl. Phys. Lett.
83 (2003) 48–50. DOI
Sathe, Ajit V, , Michael J Witherspoon, Ravi S. Prasher, and Kristopher J. Frutschy."Electronic assembly having a heat pipe that conducts heat from a semiconductor die."
(2003).
Prasher, Ravi S., , J Shipley, , S Prstic, and others."Thermal resistance of particle laden polymeric thermal interface materials."ASME 2003
(2003). DOI
2002
Jiang, , Linan, , Jae-Mo Koo, Evelyn N. Wang, , Abdullahel Bari, , Eun Seok Cho, , Wendy Ong, Ravi S. Prasher, James G Maveety, , Min Soo Kim, , Thomas W Kenny, , Juan G Santiago, and Kenneth E Goodson."Cross-Linked Microchannels for VLSI Hotspot Cooling."ASME 2002 International Mechanical Engineering Congress and Exposition
(2002). DOI
Prasher, Ravi S., , J Shipley, , S Prstic, and others."Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 2–-Modeling."ASME 2002
(2002). DOI
Chrysler, Gregory M ., Ravindranath V. Mahajan, and Ravi S. Prasher."Spreading in the heat sink base: Phase change systems or solid metals??."IEEE Transactions on
(2002).
Koo, , Jae-Mo, , Sungjun Im, , Eun Seok Cho, Ravi S. Prasher, Evelyn N. Wang, , Linan Jiang, , Abdullahel Bari, , David Campion, David W. Fogg, , Min Soo Kim, , Thomas W Kenny, , Juan G Santiago, and Kenneth E Goodson."VLSI Hotspot Cooling Using Two-Phase Microchannel Convection."ASME 2002 International Mechanical Engineering Congress and Exposition
(2002) 13–19. DOI
2001
Prasher, Ravi S., and Patrick E. Phelan."Erratum: "A Scattering-Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance'' [ASME J. Heat Transfer, 123, No. 1, pp. 105–112]."Journal of Heat Transfer
123 (2001) 1194–1194. DOI
Prasher, Ravi S., , J Shipley, and Amit Devpura."A simplified modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."ASME-PUBLICATIONS-HTD
(2001). DOI
Prasher, Ravi S., , O Alger, and Patrick E. Phelan."A unified macroscopic and microscopic approach to contact conduction heat transfer."2001 National Heat
(2001).
Prasher, Ravi S.."Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials."J. Heat Transfer
(2001). DOI
Prasher, Ravi S., and Patrick E. Phelan."A Scattering-Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance."Journal of Heat Transfer
123.1 (2001) 105. DOI